SEC TECH-CLASS
November 13 to 14, 2025
IPC ASSISTED DESIGN OF FLEXIBLE PCB
Registrations ⇒
Download Flyer
DETAILS
- From Thursday November 13, 2025 at 8:30 a.m.
- Until Friday November 14, 2025 at 17:30 p.m.
- Location: Restaurant Terminal 60, Route de l’Aéroport 60, 1950 SION
- Minimum number of registrations: 10
- Maximum number of registrations: 25
- Language: French and/or English (depending on the audience)
- Registration closure: October 31, 2025
EDUCATIONAL GOALS
- Flex and Rigid Flex technologies for a « 3D Design » approach of competitive and robust electronic systems combined with high-density HDI and/or high-speed HSD requirements
TARGET AUDIENCE
- Electronic (and mechanical) technicians and engineers
PREREQUISITE
- Motivation for 3D circuit interpretation
- General knowledge of electronics
- Basic knowledge of PCB design
REGISTRATION FEES
- Non-member of the SEC: CHF 1’600.- / person
- SEC BLUE member: CHF 800.- / person
- SEC SILVER or SEC GOLD member: CHF 400.- / person
- SEC SPONSOR member: Free
- Payment term: in advance
TRAINER
- Sylvain LE ROUX, Director of JETWARE since 2010, IPC CID/CID+ Instructor with 30 years of DFM experience for PCB design
DESCRIPTION
- Identification of the Flex IPC 2223 Design codes
- Flex Type 1/2/3/4/5
- Uses A/B/C/D
- Static/Dynamic requirements
- High Thermal conditions
- UL identification
- Specific Designations of the Flexible Polyimide film base material: IPC 4102/03/04
- Selection of materials to build flexible boards
- Identification of the properties of copper laminates
- Implementation of coverlays
- Copper selection dedicated to bending by IPC 4562
- Mechanical characteristics of copper
- Permissible number of bends
- Elongation performance according to environmental temperature
- Design rules for each type of Flex IPC 2223
- Single side type 1
- Double side PTH type 2
- Multi layer Flex type 3
- Type 4 rigid-flex
- Double side or Multi layer Type 5
- Industrial process consideration for fabrication and Assembly IPC 2223
- Identification of the different areas
- Identification of the mechanical stresses
- Definition of the assembly array and processing of panel setting
- Manufacture of rigid Flex with/without HDI technology IPC 6013 dedicated to the fabrication
- Realization of the type 4 rigid flex
- Analysis of equipment and manufacturing processes
- Configuration of FPC HDI by the implementation of laser drilling
- Integration of high frequency signals in Flexible boards HSD
- Impedance line implementation
- Performance evaluation
- Construction of Flex dedicated to the high-speed connectors