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SEC TECH-CLASS

November 13 to 14, 2025

IPC ASSISTED DESIGN OF FLEXIBLE PCB

Registrations ⇒

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DETAILS

  • From Thursday November 13, 2025 at 8:30 a.m.
  • Until Friday November 14, 2025 at 17:30 p.m.
  • Location: Restaurant Terminal 60, Route de l’Aéroport 60, 1950 SION
  • Minimum number of registrations: 10
  • Maximum number of registrations: 25
  • Language: French and/or English (depending on the audience)
  • Registration closure: October 31, 2025

EDUCATIONAL GOALS

  • Flex and Rigid Flex technologies for a « 3D Design » approach of competitive and robust electronic systems combined with high-density HDI and/or high-speed HSD requirements

TARGET AUDIENCE

  • Electronic (and mechanical) technicians and engineers

PREREQUISITE

  • Motivation for 3D circuit interpretation
  • General knowledge of electronics
  • Basic knowledge of PCB design

REGISTRATION FEES

  • Non-member of the SEC: CHF 1’600.- / person
  • SEC BLUE member: CHF 800.- / person
  • SEC SILVER or SEC GOLD member: CHF 400.- / person
  • SEC SPONSOR member: Free
  • Payment term: in advance

TRAINER

  • Sylvain LE ROUX, Director of JETWARE since 2010, IPC CID/CID+ Instructor with 30 years of DFM experience for PCB design

DESCRIPTION

  1. Identification of the Flex IPC 2223 Design codes
  • Flex Type 1/2/3/4/5
  • Uses A/B/C/D
  • Static/Dynamic requirements
  • High Thermal conditions
  • UL identification
  1. Specific Designations of the Flexible Polyimide film base material: IPC 4102/03/04
  • Selection of materials to build flexible boards
  • Identification of the properties of copper laminates
  • Implementation of coverlays
  1. Copper selection dedicated to bending by IPC 4562
  • Mechanical characteristics of copper
  • Permissible number of bends
  • Elongation performance according to environmental temperature
  1. Design rules for each type of Flex IPC 2223
  • Single side type 1
  • Double side PTH type 2
  • Multi layer Flex type 3
  • Type 4 rigid-flex
  • Double side or Multi layer Type 5
  1. Industrial process consideration for fabrication and Assembly IPC 2223
  • Identification of the different areas
  • Identification of the mechanical stresses
  • Definition of the assembly array and processing of panel setting
  1. Manufacture of rigid Flex with/without HDI technology IPC 6013 dedicated to the fabrication
  • Realization of the type 4 rigid flex
  • Analysis of equipment and manufacturing processes
  • Configuration of FPC HDI by the implementation of laser drilling
  1. Integration of high frequency signals in Flexible boards HSD
  • Impedance line implementation
  • Performance evaluation
  • Construction of Flex dedicated to the high-speed connectors