SEC TECH-CLASS

March 12 to 14, 2024
THE ESSENTIALS OF THERMAL FOR ELECTRONICS

Registrations closed
(The maximum number of participants has been reached)

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DETAILS

• From Tuesday March 12, 2024 at 8:30 a.m.
• Until Thursday March 14, 2024 at 12:00 p.m.
• Location: Ateliers Industriels CFF, Quai des Ateliers 1, 1400 YVERDON-LES-BAINS
• Minimum number of registrations: 05
• Maximum number of registrations: 12
• Language: French
• Registration closure: February 25, 2024

EDUCATIONAL GOALS

• Acquire precise knowledge of the physical phenomena involved in heat transfer within electronic devices
• Know the different technical heat removal processes in these devices and know how to choose them
• Know how to correctly size the thermal process(es) implemented in the designs of electronic or electrical equipment through simulation

TARGET AUDIENCE

• Electronic and mechanical technicians and engineers

PREREQUISITE

• Mathematics basics baccalaureate level, use of a spreadsheet
• Some theoretical notions require a mathematical level of second year university to be fully assimilated
• General knowledge of electronics, no initial thermal knowledge is necessary

REGISTRATION FEES

• Non-member of the SEC: CHF 2’000.- / person
• SEC BLUE member: CHF 1’000.- / person
• SEC SILVER or SEC GOLD member: CHF 500.- / person
• SEC SPONSOR member: Free
• Payment term: in advance

TRAINER

• Philippe GUILLEMET, Director of Thermodel-rd, thermal expert in a design office specializing in electronics, former teacher-researcher at the University of Nantes

DESCRIPTION

1. Modes of heat transfer

• Transfer by conduction
• Transfert par convection
• Transfert par rayonnement

2. Heat removal devices

• Thermal of interfaces, films and pastes
• Conventional cooling methods
• Sophisticated cooling methods
• Critical and comparative analysis of methods, tips for use, pitfalls to avoid

3. Thermal of the PCB

• Thermal of tracks on PCB PCB
• Thermal of components on PCB

4. Methods for calculating and simulating heat transfers

• Thermal sizing method
• Thermal analysis of a device and simplification
• Elementary analytical calculation of sizing
• Critical analysis of the result and the search for optimization
• Application exercises
• Simulation methodology

5. Measurement of thermal and fluid quantities

• Temperature measurement
• Other thermophysical measurements

6. Forms and digital data

• Calculation tools
• Data tables

7. Practical case studies

• Free discussion around the different situations proposed by the trainees